TY  - RPRT
TI  - Robust hydrogel-integrated microsystems enabled by enhanced interfacial bonding strength
AU  - Bae, S.
AU  - Kim, Y.-W.
AU  - Sun, J.-Y.
AU  - Kwon, S.
PY  - 2022
DO  - 10.1101/2021.12.31.474677
UR  - https://www.biorxiv.org/content/10.1101/2021.12.31.474677v1
ID  - 10.1101/2021.12.31.474677
ER  -